| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SL1461S | ZARLINK | SOP16 | 98+ | 650 | 2026-05-11 | |||
| SL1461SAB | ZARLINK | SOP16 | 98+ | 650 | 2026-05-11 | |||
| C8051F300-GMR | SILICON/芯科 | QFN | 20+ | 9989 | 2025-08-14 | |||
| REF198G | ADI/亚德诺 | SOP8 | 10+ | 15000 | 2025-08-14 | |||
| PGA281AIPWR | TI/德州仪器 | SSOP16 | 19+ | 471 | 2025-08-14 | ![]() |
||
| IS61LV6416-10TLI | ISSC | TSOP44 | 20+ | 700 | 2025-08-14 | |||
| SST39VF040-70-4I-WH | SST/超捷 | 20+ | 594 | 2025-08-14 | ||||
| MPC8270VVUPEA | FREESCALE/飞思卡尔 | BGA | 13+ | 160 | 2025-08-14 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SST39VF040-70-4I-WH | SST/超捷 | 20+ | 594 | 2025-08-14 | ||||
| TA7502P | TOSHIBA/东芝 | DIP8 | 10+ | 5200 | 2023-12-29 | |||
| D78F0485 | NEC/日电电子 | QFP80 | 20+ | 5080 | 2023-12-29 | |||
| RA8835P3N | RAIO/瑞佑 | QFP | 10+ | 10000 | 2023-12-29 | |||
| TCD1208P | TOSHIBA/东芝 | CCD | 14+ | 5000 | 2023-12-29 | |||
| PD9539 | TI/德州仪器 | QFN | 18+ | 5335 | 2023-12-29 | |||
| LX1973AIDU-TR | MICROSEMI/美高森美 | MSOP8 | 1038+ | 11600 | 2023-12-29 | |||
| REF195F | ADI/亚德诺 | SOP8 | 20+ | 910 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PGA281AIPWR | TI/德州仪器 | SSOP16 | 19+ | 471 | 2025-08-14 | ![]() |
||
| AD8554ARZ | ADI/亚德诺 | SOP16 | 20+ | 400 | 2023-12-29 | |||
| AD8008AR | ADI/亚德诺 | SOP8 | 20+ | 400 | 2023-12-29 | |||
| LMC6484IM | NS/美国国半 | SOP14 | 20+ | 400 | 2023-12-29 | |||
| TLC2272CP | TI/德州仪器 | DIP8 | 20+ | 400 | 2023-12-29 | |||
| OPA2354AI | TI/德州仪器 | SOP8 | 13+ | 520 | 2023-12-29 | |||
| AD8606A | ADI/亚德诺 | SOP8 | 13+ | 400 | 2023-12-29 | |||
| ATIC39-B4 A2C08350 | ST/意法 | QFP | 18+ | 5520 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SL1461S | ZARLINK | SOP16 | 98+ | 650 | 2026-05-11 | |||
| SL1461SAB | ZARLINK | SOP16 | 98+ | 650 | 2026-05-11 | |||
| REF198G | ADI/亚德诺 | SOP8 | 10+ | 15000 | 2025-08-14 | |||
| BTS724G | INFINEON/英飞凌 | SOP20 | 20+ | 2402 | 2023-12-29 | |||
| LM2675M-ADJ | NS/美国国半 | SOP8 | 13+ | 400 | 2023-12-29 | |||
| MAX704ESA | MAXIM/美信 | SOP8 | 13+ | 189 | 2023-12-29 | |||
| L4981AD | ST/意法 | SOP20 | 20+ | 400 | 2023-12-29 | |||
| TL3843 | TI/德州仪器 | SOP8 | 20+ | 315 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UPD78F0485GK-GAK-AX | NEC/日电电子 | QFP80 | 20+ | 508 | 2023-12-29 | |||
| MAX5523EUA | MAXIM/美信 | MSOP8 | 20+ | 400 | 2023-12-29 | |||
| MAX5533EUA | MAXIM/美信 | MAOP8 | 20+ | 400 | 2023-12-29 | |||
| TDK5100 | INFINEON/英飞凌 | TSSOP16 | 10+ | 5000 | 2023-12-29 | |||
| MAX1672EEE | MAXIM/美信 | SSOP16 | 20+ | 350 | 2023-12-29 | |||
| AD9245BCPZ-20 | ADI/亚德诺 | QFN | 20+ | 12 | 2023-12-29 | |||
| ADSP-2105KP-40 | ADI/亚德诺 | PLCC84 | 20+ | 553 | 2023-12-29 | |||
| LVT125 | TI/德州仪器 | SOP14 | 20+ | 300 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AM29F400BB-70SE | ADVANCED MICRO DEVICES | SOP44 | 20+ | 5500 | 2023-12-29 | |||
| AM29F010B-90JC | ADVANCED MICRO DEVICES | PLCC32 | 20+ | 5110 | 2023-12-29 | |||
| P89LPC931FDH | NXP/恩智浦 | TSSOP28 | 19+ | 4999 | 2023-12-29 | |||
| SAB80C537-16-N | INFINEON/英飞凌 | PLCC84 | 20+ | 224 | 2023-12-29 | |||
| P89C668HBA | NXP/恩智浦 | PLCC44 | 20+ | 110 | 2023-12-29 | |||
| MC68HC11A1FN | MOTOROLA/摩托罗拉 | PLCC52 | 20+ | 260 | 2023-12-29 | |||
| AM29LV160DB-70EC | ADVANCED MICRO DEVICES | TSOP48 | 20+ | 20 | 2023-12-29 | |||
| MC68331CFC16 | MOTOROLA/摩托罗拉 | QFP132 | 20+ | 90 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CLRC66301HN | NXP/恩智浦 | QFN | 15+ | 11158 | 2025-08-14 | |||
| UCC27325 | TI/德州仪器 | SOP-8 | 10+ | 15000 | 2023-12-29 | |||
| RA8835AP3N | RAIO/瑞佑 | QFP60 | 18+ | 4000 | 2023-12-29 | |||
| PCF85162T | NXP/恩智浦 | TSSOP48 | 19+ | 4999 | 2023-12-29 | |||
| 96632 | NXP/恩智浦 | QFN | 15+ | 11158 | 2023-12-29 | |||
| MAX5947BESA | MAXIM/美信 | SOP8 | 20+ | 400 | 2023-12-29 | |||
| AD7608BSTZ | ADI/亚德诺 | QFP64 | 20+ | 13 | 2023-12-29 | |||
| 96632 | NXP/恩智浦 | QFN | 20+ | 11250 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PCA9539RGER | TI/德州仪器 | QFN | 18+ | 5335 | 2023-12-29 | |||
| CX06833-44 | CONEXANT | QFP144 | 19+ | 1500 | 2023-12-29 | |||
| KSZ9031RNXCA | MICREL/麦瑞 | QFN | 19+ | 10 | 2023-12-29 | |||
| ADUM1411ARWZ | ADI/亚德诺 | SOP16 | 20+ | 5330 | 2023-12-29 | |||
| ADUM2201ARWZ | ADI/亚德诺 | SOP16 | 20+ | 220 | 2023-12-29 | |||
| ISO7740DWR | TI/德州仪器 | SOP16 | 20+ | 5427 | 2023-12-29 | |||
| PCA9517 | NXP/恩智浦 | SOP8 | 20+ | 9 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DSPIC33FJ64GS606-50I/PT | MICROCHIP/微芯 | QFP64 | 17+ | 8019 | 2023-12-29 | |||
| ATMEGA128-16AU | ATMEL/爱特梅尔 | QFP64 | 20+ | 555 | 2023-12-29 | |||
| AT89C52-24PI | ATMEL/爱特梅尔 | DIP40 | 20+ | 55 | 2023-12-29 | |||
| DSPIC30F6013A-30I/PT | MICROCHIP/微芯 | QFP80 | 21+ | 1019 | 2023-12-29 | |||
| VB325SP | ST/意法 | SOP20 | 20+ | 515 | 2023-12-29 | |||
| CD4094BF3A | TI/德州仪器 | CDIP16 | 20+ | 12 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32F103ZET6 | ST/意法 | QFP144 | 20+ | 12158 | 2023-12-29 | ![]() |
||
| STM32L471VET6 | ST/意法 | QFP100 | 20+ | 110 | 2023-12-29 | |||
| STM32F765ZGT6 | ST/意法 | QFP144 | 20+ | 20 | 2023-12-29 | |||
| STM32F103VGT6 | ST/意法 | QFP100 | 20+ | 200 | 2023-12-29 | |||
| ADSP-21062CSZ-160 | ADI/亚德诺 | QFP240 | 20+ | 2 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UA2-5NU | NEC/日电电子 | DIP | 12+ | 8850 | 2023-12-29 | |||
| LMP2022MA | NS/美国国半 | SOP8 | 20+ | 755 | 2023-12-29 | |||
| HA6893 | PANASONIC/松下 | SIP15 | 02+ | 110 | 2023-12-29 | |||
| REF5040IDR | TI/德州仪器 | SOP8 | 20+ | 51 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MB90F387S | FUJITSU/富士通 | 10+ | 500 | 2025-08-14 | ||||
| X9258US | N/A | SOP24 | 20+ | 175 | 2025-08-14 | |||
| XC2S100-5TQ144I | N/A | QFP144 | 20+ | 71 | 2025-08-14 | |||
| EPM7512AETC144-12N | N/A | QFP144 | 20+ | 1116 | 2025-08-14 | |||
| CSI24C44LI | CSI | DIP8 | 20+ | 350 | 2025-08-14 | |||
| INA128PA | TI/德州仪器 | DIP8 | 20+ | 1450 | 2025-08-14 | |||
| ISO7221BD | TI/德州仪器 | SOP8 | 20+ | 1610 | 2025-08-14 | |||
| STM32F217VET6 | ST/意法 | QFP100 | 20+ | 1292 | 2025-08-14 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MB90F387S | FUJITSU/富士通 | 10+ | 500 | 2025-08-14 | ||||
| SAK-C167CS-LM | Infineon/英飞凌 | QFP144 | 16+ | 5570 | 2025-08-14 | |||
| AM26C31IDBR | TI/德州仪器 | ssop16 | 17+ | 12158 | 2025-08-13 | ![]() |
||
| AV102 | ALPHA | 3 | 2023-12-29 | |||||
| 4570 | NEC/日电电子 | 40 | 2023-12-29 | |||||
| 4572 | NEC/日电电子 | 500 | 2023-12-29 | |||||
| IR20153S | INFINEON/英飞凌 | 15 | 2023-12-29 | |||||
| IR22141SS | INFINEON/英飞凌 | 20 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LM2904 | TI/德州仪器 | 300 | 2023-12-29 | |||||
| MC1458 | TI/德州仪器 | 40 | 2023-12-29 | |||||
| CD4094B | TI/德州仪器 | 1 | 2023-12-29 | |||||
| CD4016BM | TI/德州仪器 | 1 | 2023-12-29 | |||||
| CD4071BM | TI/德州仪器 | 1 | 2023-12-29 | |||||
| NE556 | TI/德州仪器 | 1 | 2023-12-29 | |||||
| CD4050B | TI/德州仪器 | 1 | 2023-12-29 | |||||
| CD4052B | TI/德州仪器 | 1 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| INA128PA | TI/德州仪器 | DIP8 | 20+ | 1450 | 2025-08-14 | |||
| LF353 | TI/德州仪器 | 12 | 2023-12-29 | |||||
| LM393A | TI/德州仪器 | 40 | 2023-12-29 | |||||
| LM258A | TI/德州仪器 | 5 | 2023-12-29 | |||||
| TL061C | TI/德州仪器 | 1 | 2023-12-29 | |||||
| LM311 | TI/德州仪器 | 20 | 2023-12-29 | |||||
| tl062i | TI/德州仪器 | 11 | 2023-12-29 | |||||
| LM258 | TI/德州仪器 | 80 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AM29LV160DB-70ED | ADVANCED MICRO DEVICES | TSSOP | 0536+ | 22 | 2023-12-29 | |||
| S29GL256P11TFI02 | SPANSION/飞索半导体 | TSOP56 | 16+ | 600 | 2023-12-29 | |||
| HY27UT084G2M | SKHYNIX/海力士 | TSOP48 | 16+ | 600 | 2023-12-29 | |||
| AM29LV040B-120JI | ADVANCED MICRO DEVICES | PLCC32 | 16+ | 600 | 2023-12-29 | |||
| D71054C | NEC/日电电子 | DIP24 | 16+ | 600 | 2023-12-29 | |||
| D71055L-10 | NEC/日电电子 | PLCC44 | 16+ | 600 | 2023-12-29 | |||
| D71055C | NEC/日电电子 | DIP40 | 16+ | 600 | 2023-12-29 | |||
| 82C55AC-2 | NEC/日电电子 | DIP40 | 16+ | 600 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MAX704ESA | MAXIM/美信 | SOP-8 | 15+ | 10000 | 2025-08-14 | |||
| UC3854N | TI/德州仪器 | 80 | 2023-12-29 | |||||
| UC2854N | TI/德州仪器 | DIP16 | 16+ | 1205 | 2023-12-29 | |||
| BQ2057W | TI/德州仪器 | 3 | 2023-12-29 | |||||
| 5430 | TI/德州仪器 | 17 | 2023-12-29 | |||||
| NE555 | TI/德州仪器 | 100 | 2023-12-29 | |||||
| LM339 | TI/德州仪器 | 1 | 2023-12-29 | |||||
| HC27 | TI/德州仪器 | 19 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PBL3717/2 | ERICSSON/爱立信 | DIP16 | 16+ | 600 | 2023-12-29 | |||
| LX1689IPW | MICROSEMI/美高森美 | SSOP | 16+ | 600 | 2023-12-29 | |||
| PS2501-4 | NEC/日电电子 | DIP16 | 16+ | 600 | 2023-12-29 | |||
| LV574A | TI/德州仪器 | 1 | 2023-12-29 | |||||
| LXH541 | TI/德州仪器 | 2 | 2023-12-29 | |||||
| CKV2310 | TI/德州仪器 | 7 | 2023-12-29 | |||||
| m33078 | TI/德州仪器 | 40 | 2023-12-29 | |||||
| HC373 | TI/德州仪器 | 1 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DM9000EP | DAVICOM/联杰国际 | QFP100 | 16+ | 600 | 2023-12-29 | |||
| UCC5606DP | TI/德州仪器 | 6 | 2023-12-29 | |||||
| GD75232 | TI/德州仪器 | 6 | 2023-12-29 | |||||
| MAX232EC | TI/德州仪器 | 1 | 2023-12-29 | |||||
| SN75189A | TI/德州仪器 | 14 | 2023-12-29 | |||||
| SN75175 | TI/德州仪器 | 3 | 2023-12-29 | |||||
| SN75188 | TI/德州仪器 | 15 | 2023-12-29 | |||||
| CD4051BM | TI/德州仪器 | 50 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CD4066BM | TI/德州仪器 | 20 | 2023-12-29 | |||||
| SN74CBT3257RGYR | TI/德州仪器 | QFN-16 | 04+ | 15 | 2023-12-29 | |||
| SN74LV4051APW | TI/德州仪器 | TOSSOP | LW051A | 120 | 2023-12-29 | |||
| SN74CBT3253PW | TI/德州仪器 | TOSSOP | CU253 | 500 | 2023-12-29 | |||
| CD4052BPW | TI/德州仪器 | TOSSOP | CM052B | 250 | 2023-12-29 | |||
| CD4053BPW | TI/德州仪器 | TOSSOP | CM053B | 250 | 2023-12-29 | |||
| SN74LV4053APW | TI/德州仪器 | TOSSOP | LW053A | 2000 | 2023-12-29 | |||
| SN74CBT3257PW | TI/德州仪器 | TOSSOP | CU257 | 300 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MM74HC126MTC | FAIRCHILD/仙童 | TSSOP | 04+ | 30 | 2023-12-29 | |||
| IR2136S | INFINEON/英飞凌 | 25 | 2023-12-29 | |||||
| IR2110 | INFINEON/英飞凌 | DIP16 | 16+ | 600 | 2023-12-29 | |||
| IR2113S | INFINEON/英飞凌 | SOP16 | 16+ | 600 | 2023-12-29 | |||
| IR2110 | INFINEON/英飞凌 | DIP14 | 16+ | 600 | 2023-12-29 | |||
| IR2113 | INFINEON/英飞凌 | DIP14 | 16+ | 600 | 2023-12-29 | |||
| TC427EOA | MICROCHIP/微芯 | SOP-8 | 16+ | 600 | 2023-12-29 | |||
| SM1628C | SM/明微 | 1004+ | 100 | 2023-12-29 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LMX2306TMX/NOPB | TI/德州仪器 | SSOP16 | 18+ | 50000 | 2025-08-14 | |||
| DS1230Y-150 | DALLAS SEMICONDUCTOR | 16+ | 600 | 2023-12-29 | ||||
| WM9708SCDS | WOLFSON/欧胜 | 600 | 2023-12-29 | |||||
| 28084 | TI/德州仪器 | 1 | 2023-12-29 | |||||
| MAX4644EUA | MAXIM/美信 | 50 | 2023-12-29 | |||||
| 33161 | MOTOROLA/摩托罗拉 | 25 | 2023-12-29 | |||||
| MAX6653 | MAXIM/美信 | 3 | 2023-12-29 | |||||
| MAX618EEE | MAXIM/美信 | SSOP | 16+ | 600 | 2023-12-29 |